1. 1.0 Electronics
1.1. 1.1 Design of electronics enclosure
1.1.1. 1.1.2 Interface with 3DUI snapfit coupling
1.1.2. 1.1.3 Exploit existing enclosure from model E10 for securing electronics
1.2. 1.2 Enclosure manufacturing
1.2.1. 1.2.1 Injection molding tooling utilizing same supplier as E10 product.
1.3. 1.3 Coordinate with E10 planning team to allocate materials for Conform.
2. 2.0 3D Printed User Interface (3DUI)
2.1. 2.1 3D Printer selection
2.1.1. 2.1.1 Determination of optimal printing configuration
2.1.1.1. 2.1.1.1 Three level full factorial DOE considering; layer thickness, fill density, and print speed.
2.1.1.2. 2.1.1.2 Case study to determine optimal print orientation and multiple part layout to maximize output from single printer
2.2. 2.2 Scanner selection
2.2.1. 2.2.1 Perform testing with suppliers using a minimum of 3 different lightning environments
2.2.2. 2.2.2 Perform testing using samples with a feature size less than .1 inches.
2.3. 2.3 Material Selection
2.4. 2.4 3DUI Integration with electronic packaging
2.4.1. 2.4.1 Snap fit coupling design
2.4.2. 2.4.2 Stress analysis
2.5. 2.5 Production Readiness
2.5.1. 2.5.1 Evaluate post processing steps including support structure removal, sanding, painting, curing.
2.6. 2.6 Capturing user interface
2.6.1. 2.6.1 Select malleable material that end user can imprint their grip.
2.6.2. 2.6.2 Develop work instructions for end user to provide accurate imprint.
3. 3.0 Software
3.1. 3.1 Processing of point cloud data
3.2. 3.2 Algorithm to generate mesh from point cloud data
3.2.1. 3.2.1 Method to merge standardized coupling mechanism on generated mesh
3.2.2. 3.2.2 Method to incorporate pressure point relief and wrist support on generated mesh.
3.3. 3.3 Slicer development to communicate with printer
3.3.1. 3.3.1 Incorporate appropriate print speed, layer thickness, and density.
4. 4.0 Packaging
4.1. 4.1 Coordinate with current packaging supplier from E10 product line to support packaging of Conform.
5. 5.0 Testing
5.1. 5.1 Development of test equipment
5.1.1. 5.1.1 Design automated rig to test robustness of coupling mechanism.
5.1.2. 5.1.2 Design test rig to evaluate wear on 3DUI surfaces that will interface with the user.