1. 1. Types of Bonding
1.1. Ionic Bonding
1.1.1. Formation of ions (positive and negative)
1.1.2. Transfer of electrons
1.1.3. Example: Sodium Chloride (NaCl)
1.1.4. Properties:
1.1.4.1. High melting/boiling points
1.1.4.2. Conduct electricity when molten or in solution
1.2. Covalent Bonding
1.2.1. Sharing of electrons
1.2.2. Formation of molecules
1.2.3. Example: Water (H₂O)
1.2.4. Properties:
1.2.4.1. Low melting/boiling points
1.2.4.2. Do not conduct electricity
1.3. Metallic Bonding
1.3.1. Properties:
1.3.1.1. Conducts electricity
1.3.1.2. Malleable and ductile
1.3.1.3. High melting/boiling points
1.3.2. Delocalized electrons
1.3.3. Strong attraction between positive ions and electrons
1.3.4. Example: Copper (Cu)
2. 4. Real-World Applications
2.1. Ionic Compounds
2.1.1. Use in electrolytes, salts
2.2. Covalent Compounds
2.2.1. Use in organic chemistry, pharmaceuticals
2.3. Metallic Compounds
2.4. Use in electrical wiring, construction materials
3. 2. Bonding Structures
3.1. Giant Covalent Structures
3.1.1. Properties:
3.1.1.1. High melting/boiling points
3.1.1.2. Diamond: hard, non-conductive
3.1.1.3. Graphite: soft, conductive
3.1.2. Networks of atoms
3.1.3. Strong covalent bonds
3.1.4. Examples: Diamond, Graphite
3.2. Ionic Lattice
3.2.1. Strong electrostatic forces of attraction
3.2.2. Regular arrangement of ions
3.2.3. High melting/boiling points
3.3. Simple Molecular Structures
3.3.1. Low melting/boiling points
3.3.2. Small molecules
3.3.3. Weak intermolecular forces
3.4. Metallic Lattice
3.4.1. Layers of ions in a sea of electrons
3.4.2. Strong metallic bonds
3.4.3. Malleable, ductile, and conductive