1. Components
1.1. Extern
1.1.1. Keyboard
1.1.2. LCD Display
1.1.3. Modem
1.1.4. Notebook carrying bag
1.1.5. Power adapter
1.1.6. Power cord
1.1.7. Removable memory stick
1.2. Intern
1.2.1. Intel microprocessor
1.2.2. Memory
1.2.3. Graphics card
1.2.4. Cooling fan
1.2.5. Motherboard
1.2.6. Wireless card
1.2.7. Battery
1.2.8. Hard disk drive
1.2.9. CD/DVD drive
2. Key Suppliers
2.1. Ireland
2.1.1. Tenba
2.2. Korea
2.2.1. Samsung
2.2.2. LG.Philips LCD
2.2.3. SDI
2.2.4. Simplo
2.3. Japan
2.3.1. Elpida
2.3.2. Alps
2.3.3. Toshiba
2.3.4. Sharp
2.3.5. Sanyo
2.3.6. Hitachi
2.3.7. Fujitsu
2.3.8. NEC
2.3.9. Teac
2.3.10. Sony
2.4. Taiwan
2.4.1. Nanya
2.4.2. MSI
2.4.3. CCI
2.4.4. Auras
2.4.5. Quanta
2.4.6. Compal
2.4.7. Wistron
2.4.8. Darfon
2.4.9. Chi Mei Optoelectronics
2.4.10. Hannstar Display
2.4.11. AU Optronics
2.4.12. Askey
2.4.13. Gemtek
2.4.14. Austek
2.4.15. Liteon
2.5. Germany
2.5.1. Infineon
2.6. China
2.6.1. Foxconn
2.6.2. USI
2.7. Malaysia
2.7.1. Arrow
2.8. America
2.8.1. Agere
2.8.2. Motorola
2.8.3. Seagate
2.8.4. Targus
2.8.5. Samsonite
2.8.6. Pacific Design
2.8.7. Mobility
2.8.8. Smart Modular
2.9. Thailand
2.9.1. Delta
2.10. Britain
2.10.1. Volex
2.11. Israel
2.11.1. M-System
3. Process
3.1. SLCs
3.1.1. Just-in-time manufacturing
3.2. Design
3.2.1. Austin, Texas & Taiwan
3.2.2. Redesign every 12 months
3.2.3. Basic design from ODM
3.3. New features during the year
3.3.1. Software
3.3.2. Hardware
4. Systems
4.1. Management team
4.1.1. Austin, Texas
4.2. Production
4.2.1. Limerick, Ireland
4.2.2. Austin, Texas
4.2.3. Penang, Malaysia
4.2.4. Nashville, Tennessee
4.2.5. Eldorado do Sul, Brazil
4.2.6. Xiamen, China