1. Process
1.1. SLCs
1.1.1. Just-in-time manufacturing
1.2. Design
1.2.1. Austin, Texas & Taiwan
1.2.2. Redesign every 12 months
1.2.3. Basic design from ODM
1.3. New features during the year
1.3.1. Software
1.3.2. Hardware
2. Components
2.1. Intern
2.1.1. Intel microprocessor
2.1.2. Memory
2.1.3. Graphics card
2.1.4. Cooling fan
2.1.5. Motherboard
2.1.6. Wireless Card
2.1.7. Battery
2.1.8. Hard disc drive
2.1.9. CD/DVD drive
2.2. Extern
2.2.1. Removable memory stick
2.2.2. Keyboard
2.2.3. LCD Display
2.2.4. Modem
2.2.5. Notebook carrying bag
2.2.6. Power adapter
2.2.7. Power cord
3. Systems
3.1. Management team
3.1.1. Austin, Texas
3.2. Production
3.2.1. Limerick, Ireland
3.2.2. Austin, Texas
3.2.3. Penang, Malaysia
3.2.4. Nashville, Tennessee
3.2.5. Eldorado do Sul, Brazil
3.2.6. Xiamen, China
4. Key suppliers
4.1. Ireland
4.1.1. Tenba
4.2. Korea
4.2.1. Samsung
4.2.2. LG. Philips LCD
4.2.3. SDI
4.2.4. Simplo
4.3. Japan
4.3.1. Elpida
4.3.2. Toshiba
4.3.3. Sharp
4.3.4. Sanyo
4.3.5. Hitachi
4.3.6. Fujitsu
4.3.7. Alps
4.3.8. NEC
4.3.9. Teac
4.3.10. Sony
4.4. Taiwan
4.4.1. MSI
4.4.2. Nanya
4.4.3. CCI
4.4.4. Auras
4.4.5. Quanta
4.4.6. Compal
4.4.7. Wistron
4.4.8. Darfon
4.4.9. Chi Mei Optoelectronics
4.4.10. Hannstar Display
4.4.11. AU Optronics
4.4.12. Askey
4.4.13. Arrow
4.4.14. Austek
4.4.15. Liteon
4.5. Germany
4.5.1. Infineon
4.6. Malaysia
4.6.1. Arrow
4.7. China
4.7.1. Foxconn
4.7.2. USI
4.8. America
4.8.1. Agere
4.8.2. Motorola
4.8.3. Seagate
4.8.4. Targus
4.8.5. Samsonite
4.8.6. Pacific design
4.8.7. Mobility
4.8.8. Smart Modular
4.9. Thailand
4.9.1. Delta
4.10. Britain
4.10.1. Volex
4.11. Israel
4.11.1. M-System