IC FABRICATION

1. advantages /disadvantages

1.1. Advantages

1.1.1. 1

1.1.2. 2

1.1.3. 3

1.1.4. 4

1.1.5. 5

1.1.6. 6

1.2. Disadvantages

1.2.1. 1

1.2.2. 2

1.2.3. 3

1.2.4. 4

1.2.5. 5

2. method / step

2.1. Lithography

2.2. Etching

2.3. Deposition

2.4. Chemical Mechanical Polishing

2.5. Oxidation

2.6. Ion Implantation

2.7. Diffusion

3. fabrication of integrated circuit basically of the following steps. the process for pattern definition by applying thin uniform layer of viscous liquid on the wafer surface.

4. definition

5. types

5.1. Thin and thick film ICs

5.2. Monolithics ICs

5.3. Hybrid or multichips ICs

6. video

6.1. Simple IC Fabrication Process

6.2. https://youtu.be/cXem56hCq3s