semiconductor
Door Thamonwan CHAIRAJ
1. evolution
1.1. หลอดไฟ edison
1.2. diode
1.3. tramsistor
1.4. IC
2. MOSFET device scaling
2.1. MOS capacitor
2.2. MOSFET transistor
2.3. moore law
2.4. scaling factor
2.4.1. limit
3. fabrication
3.1. material
3.1.1. Si sub
3.1.2. doping Si
3.2. Si wafer preparation
3.2.1. Si crystal growth
3.3. clean room / facility
3.4. wafer fabrication process
3.4.1. wafer cleaning
3.4.2. thin film deposition
3.4.3. lithography
3.4.3.1. convention lithography process
3.4.3.1.1. photo lithography process
3.4.3.2. photomask tech
3.4.3.3. mask making process
3.4.3.3.1. mask data preoaration / mask floor planing
3.4.3.3.2. data conversion / mask tape out
3.4.3.3.3. mask making process / defect
3.4.3.3.4. binary intensity mask
3.4.3.4. exposure tool
3.4.3.5. NGL
3.4.4. etching
3.4.5. doping